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Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers from wholesalers
     
    Buy cheap Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers from wholesalers
    • Buy cheap Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers from wholesalers

    Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers

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    Brand Name : JBNR
    Model Number : HCWC003
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : D/P,L/C, T/T, Western Union
    Supply Ability : 5ton per month
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    Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers

    Heat Dissipation Tungsten Copper Flange For Ceramic Packages In Optoelectronics


    Description:

    Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

    Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

    The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.


    Advantages:

    1. High thermal conductivity

    2. Excellent hermeticity

    3. Excellent flatness, surface finish, and size control

    4. Semi-finished or finished (Ni/Au plated) products available

    5. Low porosity


    Product Properties:

    GradeW ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    90WCu90±2%17.06.5180 (25℃) /176 (100℃)
    85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
    80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
    75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
    50WCu50±2%12.212.5340 (25℃) / 310 (100℃)

    Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers

    Application:

    They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

    Quality Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers for sale
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