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MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION from wholesalers
     
    Buy cheap MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION from wholesalers
    • Buy cheap MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION from wholesalers
    • Buy cheap MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION from wholesalers

    MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

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    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    Price : Negotiable
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    MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

    MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION


    Description:


    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:


    1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


    Product Properties:


    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:


    This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


    Product picture:

    Quality MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION for sale
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