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Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) from wholesalers
     
    Buy cheap Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) from wholesalers
    • Buy cheap Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) from wholesalers
    • Buy cheap Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) from wholesalers

    Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)

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    Brand Name : JBNR
    Model Number : HCTC001
    Certification : ISO9001
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    Price : Negotiable
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    Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)

    Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)

    Descriptions:

    Packaging materials strongly effect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.


    Copper Tungsten, Molybdenum Copper, Cu/Mo/Cu, Cu/MoCu/Cu are popular refractory metals based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.


    By adjusting the content of content, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.


    Advantages:

    o High thermal conductivity

    o Excellent hermeticity

    o Excellent flatness, surface finish, and size control

    o Semi-finished or finished (Ni/Au plated) products available


    Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)


    Applications:

    Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.

    Quality Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) for sale
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