Sign In | Join Free | My himfr.com
Home > Hermetic Packages Electronics >

High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS

Zhuzhou Jiabang Refractory Metal Co., Ltd
Contact Now
    Buy cheap High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS from wholesalers
     
    Buy cheap High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS from wholesalers
    • Buy cheap High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS from wholesalers
    • Buy cheap High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS from wholesalers

    High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS

    Ask Lasest Price
    Brand Name : JBNR
    Model Number : HCMC003
    Certification : ISO9001
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 20 days
    Price : Negotiable
    • Product Details
    • Company Profile

    High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS

    Excellent Thermal Expansion Coefficient Of Molybdenmum Copper Base Plate For LDMOS


    Description:

    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:

    1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS

    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

    Quality High CTE High TC Hermetic Packages Electronics Molybdenmum Copper Base Plate For LDMOS for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Zhuzhou Jiabang Refractory Metal Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)