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Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices from wholesalers
     
    Buy cheap Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices from wholesalers
    • Buy cheap Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices from wholesalers
    • Buy cheap Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices from wholesalers

    Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices

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    Brand Name : JBNR
    Model Number : HCCP002
    Certification : ISO9001
    Payment Terms : D/P,L/C, T/T, Western Union
    Supply Ability : 5ton per month
    Price : Negotiable
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    Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices

    Strong Interface Bonding Resist 850°C Heat Shock Repeatedly Cu/MoCu/Cu Heat Sinks For LDMOS Devices


    Description:

    Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.


    Product Properties:

    GradeDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    CPC1419.57.3280(XY)/170(Z)

    Application:

    Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

    If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.

    Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices


    Related Products:

    We also offer tungsten copper heat sink (WCu), molybdenum copper (MoCu), copper molybdenum copper (Cu/Mo/Cu), copper molybdenum copper copper (Cu/MoCu/Cu) sheets or fabricated parts for microelectronics packaging and power devices.

    Quality Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices for sale
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