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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate from wholesalers
     
    Buy cheap MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate from wholesalers
    • Buy cheap MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate from wholesalers
    • Buy cheap MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate from wholesalers
    • Buy cheap MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate from wholesalers
    • Buy cheap MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate from wholesalers

    MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

    Ask Lasest Price
    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 25days
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    MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate


    MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate


    Description:

    Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.


    Advantages:

    High thermal conductivity since no sintering additives have been used

    Excellent hermeticity

    Relatively small density

    Stampable sheets available (Mo content no more than 75 wt%)

    Semi-finished or finished (Ni/Au plated) parts available


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


    Product picture:

    MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

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