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High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials from wholesalers
     
    Buy cheap High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials from wholesalers
    • Buy cheap High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials from wholesalers
    • Buy cheap High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials from wholesalers

    High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials

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    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 25days
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    High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials


    High-tech MoCu Electronic Packaging Materials With Silver Plating


    Description:

    The MoCu composite exhibits combinational properties such as high electrical and thermal conductivities, low CTE, nonmagnetic, good high-temperature performance and etc. Compared with traditional packaging materials, they have a high thermal conductivity and their CTEs can be tailored by adjusting the Mo/Cu ratio to closely match those of die materials.

    Compared with WCu materials which also enjoy high thermal conductivity and are CTE changeable, MoCu materials have a lower density.


    Advantages:

    1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Molybdenum copper composites to be used extensively in microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


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    High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials

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