Sign In | Join Free | My himfr.com
Home > Hermetic Packages Electronics >

Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

Zhuzhou Jiabang Refractory Metal Co., Ltd
Contact Now
    Buy cheap Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink from wholesalers
     
    Buy cheap Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink from wholesalers
    • Buy cheap Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink from wholesalers
    • Buy cheap Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink from wholesalers
    • Buy cheap Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink from wholesalers

    Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

    Ask Lasest Price
    Brand Name : JBNR
    Model Number : 50WCu,75WCu,80WCu,85WCu,90WCu
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    • Product Details
    • Company Profile

    Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink


    Low CTE Copper Tungsten Electronic Packaging Materials WCu Heat Sink

    Description:

    CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and tungsten (a.k.a. wolfram).

    Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.


    Advantages:

    High thermal conductivity

    Excellent hermeticity

    Excellent flatness, surface finish, and size control

    Semi-finished or finished (Ni/Au plated) products available


    Product Properties:


    GradeWt%(W)Wt%(Cu)Density
    at 20ºC
    Thermal conductivity at 25ºCCoefficient of thermal expansion at 20ºC
    W90Cu1090±1rest17.0g/cm3180-1906.5
    W85Cu1585±1rest16.4g/cm3190-2007.0
    W80Cu2080±1rest15.6g/cm3200-2108.3
    W75Cu2575±1rest14.9g/cm3220-2309.0
    W50Cu5050±1rest12.2g/cm3310-34012.5



    Application:

    Applies to high-power device package of materials, such as substrates; high-performance lead frame; military and civilian thermal control devices such as thermal control panels and radiators.


    Product picture:

    Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

    Quality Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Zhuzhou Jiabang Refractory Metal Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)