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Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging from wholesalers
     
    Buy cheap Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging from wholesalers
    • Buy cheap Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging from wholesalers
    • Buy cheap Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging from wholesalers

    Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging

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    Brand Name : JBNR
    Model Number : HCMC022
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 15-20 days
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    Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging


    Excellent X-Y Expansion Cross-rolled Moly Copper Sheet For Supporting Cases For I/C Packaging


    Description:

    With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Sheet (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

    For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.

    We can provide moly copper sheet, moly copper roll, moly copper plate for your following machining, plating.


    Advantages:

    1. high thermal conductivity and excellent hermeticity.

    2. 40% lighter weight compared to WCu materials.



    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.017200(25℃)/156(100℃)
    80MoCu80±2%9.97170(25℃)/190(100℃)
    70MoCu70±2%9.87.3200(25℃)/196(100℃)
    60MoCu60±2%9.668.4222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


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