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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip from wholesalers
     
    Buy cheap Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip from wholesalers
    • Buy cheap Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip from wholesalers
    • Buy cheap Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip from wholesalers

    Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

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    Brand Name : JBNR
    Model Number : HCMC024
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 15-20 days
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    Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip


    Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip


    Description:

    With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

    For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.


    Customers normally choose moly copper as heat sink and then they will weld DBC onto the heat sink.


    Advantages:

    1. high thermal conductivity and excellent hermeticity.

    2. 40% lighter weight compared to WCu materials.



    Product Properties:


    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.017200(25℃)/156(100℃)
    80MoCu80±2%9.97170(25℃)/190(100℃)
    70MoCu70±2%9.87.3200(25℃)/196(100℃)
    60MoCu60±2%9.668.4222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

    Product Tags:

    molybdenum element

      

    mocu heat sink

      
    Quality Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip for sale
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