Sign In | Join Free | My himfr.com
Home > Hermetic Packages Electronics >

Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Zhuzhou Jiabang Refractory Metal Co., Ltd
Contact Now
    Buy cheap Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials from wholesalers
     
    Buy cheap Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials from wholesalers
    • Buy cheap Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials from wholesalers

    Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

    Ask Lasest Price
    Brand Name : JBNR
    Model Number : 50WCu,60WCu,70WCu,85WCu
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Supply Ability : 1000000pcs per month
    Delivery Time : 25days
    • Product Details
    • Company Profile

    Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials


    Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials

    Description:

    Copper Tungsten are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:
    1. High thermal conductivity
    2. Excellent hermeticity
    3. Stampable sheets available
    4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
    5. Low void

    Product Properties:

    GradeW ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    90WCu90±2%17.06.5180 (25℃) /176 (100℃)
    85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
    80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
    75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
    50WCu50±2%12.212.5340 (25℃) / 310 (100℃)

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

    Product picture:

    Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

    Quality Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Zhuzhou Jiabang Refractory Metal Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)